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    Solder Preforms
    SOLDER PREFORMS
    Gold-based Solder Preforms

    Our Tech

    Minimum Thickness: 0.01mm, Minimum Finishing Size: 0.02*0.02mm.

    (Controlling dimensional tolerance strictly and maintaining consistency of solder volume is the precondition )

    PRODUCT SELECTION
    DETAILED INTRODUCTION
    PRODUCT LIST

    Features & Benefits

    ·  Excellent corrosion resistance

    ·  Low vapour pressure

    ·  Excellent wetting properties

    ·  High-melting-point, and creepless

    ·  High tensile strength 

    ·  Superior thermal and electrical conductivity


    Application Industries

    Military,Semiconducto,Optical Communication,Laser,Medical Equipment,Electricity.

    PRODUCT LIST
    Solid Line
    °C
    Liquidus
    Eutectic Alloy
    Density
    g/cm3
    Resistivity
    µΩ.m
    Thermal Conductivity
    W/m.K
    Thermal Expansion Coefficient
    10-6/℃
    Tensile Strength
    Mpa
    / / 217 7.78 / / / 50.2
    / / 280 14.52 0.224 57 16 276
    278 332 / / / / / /
    278 301 / 14.18 / / / /
    278 289 / 14.34 / / / /
    / / 361 14.67 14.67 44 13.4 185
    / / 910 / / / / /
    955 970 / / / / / /
    / / 1064* 19.3 0.0221 318 14 138
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