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    Solder Preforms
    SOLDER PREFORMS
    Lead-free Solder Preforms

    At present, there are many kinds of lead-free solders with ever-changing alloys. The alloy composition includes binary system, ternary system and polynary system.  

     

    Generally, most of them are composed of Sn, with appropriate addition of Ag, Zn, Cu, Sb, Bi, In and other metallic elements. With the different alloys, the properties of solders can be optimized, then to get an ideal mechanical, electrical and thermal properties. 

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    产品特性与优势

    ·  Good Mechanical Properties

    ·  Superior electrical conductivity

    ·  High thermal conductivity

     


    Typical Products

    Sn-Ag-Cu Preforms

    Sn-Ag-Cu (SAC) is the most common alloy in soldering electronics. Such as those alloys whose melting point is around 217℃, like SAC105(Sn98.5Ag1Cu0.5), SAC305 (Sn96.5Ag3Cu0.5)、SAC387(Sn95.5Ag3.8Cu0.7) and SAC405(Sn95.5Ag4Cu0.5) are usually used in reflow, wave and manual soldering. 

     

    Among above, SAC305 are more wildly used. Compared with Sn63Pb37, it has better performance on stiffness, tensile strength, yield strength, shear strength, impact strength and creep strength;  compared with Sn-Cu/Sn-Ag preforms, it’s wetting properties are better.

    PRODUCT LIST
    Solid Line
    °C
    Liquidus
    Eutectic Alloy
    Density
    g/cm3
    Resistivity
    µΩ.m
    Thermal Conductivity
    W/m.K
    Thermal Expansion Coefficient
    10-6/℃
    Tensile Strength
    Mpa
    / / 138 8.56 0.383 19 15 55.16
    138 140 / 8.57 / / / /
    217 227 / 7.32 0.133 60 / 40
    217 218 / 7.37 0.132 58 21 50
    217 220 / 7.4 0.132 57 22 48
    217 220 / 7.4 0.132 62 / 51.5
    217 218 / / / / / /
    / 221 / 7.37 0.108 33 30 39
    221 240 / 7.4 0.137 / 23 55.2
    217 220 / / / / / /
    217 227 / / / / / /
    235 240 / 7.25 0.145 28 31 40.7
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